Dr. Vimal Chaitanya

Research Interests

Materials Science and Engineering, Energy Materials, Food-Energy-Water Nexus, Electrochemistry, Materials Characterization, Materials Degradation, Corrosion, Failure Analysis

Recent Publications

(also published as V. Desai)

    1. V. Chaitanya, S. Gedara, M. Karbakhshi, and N. Khandan, “Sustainable Autarky of Food-Energy-Water (SAFE-Water), Energy-Water Nexus, 232nd Electrochemical Society Meeting, National Harbor, MD, October 1-5, 2017.
    2. G. Chen, E. Fu, M. Zhou, Y. Xu. L. Fei, S. Deng, V. Chaitanya, Y. Wang and H. Luo. “A Facile Microwave-assisted Route to Co(OH)2 and Co3O4 Nanosheet for Li-ion Battery”, J. of Alloys and Compounds, 578 (2013) 349-354.
    3. P. Mohan, T Patterson, V. Desai and Y. Sohn, “Degradation of APS CoNiCrAlY bond coats in thermal barrier coatings by vanadium and phosphorus pentoxides”, Surface and Coatings Technology, 203 (2008) 427-431.
    4. V. Krishnan, S. Bharani, J. Kapat, Y. Sohn and V. Desai, “A Simplistic Model to Study the Influence of Film Cooling on Low Temperature Hot Corrosion Rate in Coal Gas/Syngas Fired Gas Turbines, Intl J of Heat and Mass Transfer, 51 (2008) 1049-1060.
    5. J. Byeon, B. Jayaraj, S. Vishweswaraiah, S. Rhee, V. Desai and Y. Sohn, “Non-destructive Evaluation of Degradation in Multi-layered Thermal Barrier Coatings by Electrochemical Impedance Spectroscopy”, Materials Science & Engineering A, 407 (2005) 213-225.
    6. Butler, B., Chopra, M.B., Kassab, A.J. and Chaitanya, V., “Boundary Element Model for Electrochemical Dissolution under Externally Applied Low Level Stress,” Engineering Analysis with Boundary Elements, 37 (2013) 977-987.
    7. T. Du, A. Vijayakumar and V. Desai, “Effect of Hydrogen Peroxide on Oxidation of Copper in CMP Slurries Containing Glycine and Cu Ions”, Electrochemica Acta, 49 (2004) 4505-4512.
    8. L. An, Y. Wang, L. Bharadwaj, Y. Fan, L. Zhang, D. Jiang, Y. Sohn, V. Desai, J. Kapat and L. Chow, “Silicoaluminum Carbonitride with Anomalously High Resistance to Oxidation and Hot Corrosion,” Advanced Engineering Materials, 6 (2004) 337-340.
    9. T. Du, A. Vijayakumar, K. B. Sundaram and V. Desai, “Chemical Mechanical Polishing of Nickel for Applications in MEMS Devices”, Microelectronic Engineering 75 (2004) 234-241.
    10. V. Desai and D. Tamboli, “Electrochemical Method and System for Monitoring Hydrogen Peroxide Concentration in Slurries” U.S. Patent # 6972083.