Dr. Krishna Kota

Ph.D., University of Central Florida, 2008.

Ph.D., UCF, 2008

Lab: Surface-thermal-fluid Interaction REsearch Laboratory (SIRE Lab)

Research Interests:

Thermal Science and Energy

Heat Transfer, Energy Efficiency, Tailored Surface-thermal-fluid Interactions, Energy Systems, Thermal Management, Space Transportation

Recent Publications

Book Chapters

  1. Yogendra Joshi, Xiaojin Wei, Bo Dang, Krishna Kota, “Some Aspects of Microchannel Heat Transfer,” Nano-Bio- Electronic, Photonic and MEMS Packaging, Eds. C.P. Wong, Kyoung-Sik Moon, and Yi Li, Springer, New York, NY, pp. 431-477, 2010 (invited).
  2. Louis Chow, Jayanta Kapat, Krishna Kota, “Mesoscopic Energy Systems,” Annual Review of Heat Transfer, Eds. Vish Prasad, Yogesh Jaluria, and Gang Chen, Vol. 14, pp. 475-509, 2005 (invited; Prof. Chang-Lin Tien’s memorial volume).

Journals

  1. Krishna Kota, Ludovic Burton, Yogendra Joshi, “Thermal Performance of an Air-cooled Heat Sink Channel with Microscale Dimples under Transitional Flow Conditions,” Journal of Heat Transfer, Vol. 135, No. 11, 111005 (1-9), 2013 (nominated to appear in the special issue on High Heat Flux Cooling of Electronics) (doi: 10.1115/1.4024598).
  2. Krishna Kota, Pablo Hidalgo, Yogendra Joshi, Ari Glezer, “Hybrid Liquid Immersion and Synthetic Jet Heat Sink for Cooling 3-D Stacked Electronics,” Components, Packaging and Manufacturing Technology, IEEE Transactions, Vol. 2, No. 5, pp. 817-824, 2012.
  3. Krishna Kota, Louis Chow, Quinn Leland, “Laminar Film Condensation Driven Latent Thermal Energy Storage in Rectangular Containers,” International Journal of Heat and Mass Transfer, Vol. 55, No. 4, pp. 1208-1217, 2012.
  4. Liang Gong, Krishna Kota, Wenquan Tao, Yogendra Joshi, “Thermal Performance of Microchannels with Wavy Walls for Electronics Cooling,” Components, Packaging and Manufacturing Technology, IEEE Transactions, Vol. 1, No. 7, pp. 1029-1035, 2011.
  5. Liang Gong, Krishna Kota, Wenquan Tao, Yogendra Joshi, “Parametric Numerical Study of Flow and Heat Transfer in Microchannels with Wavy Walls,” Journal of Heat Transfer, Vol. 133, No. 5, 051702 (1-10), 2011.
  6. Sarada Kuravi, Krishna Kota, Jianhua Du, Louis Chow, “Numerical Investigation of Flow and Heat Transfer Performance of Nano-Encapsulated Phase Change Material (NEPCM) Slurry in Microchannels,” Journal of Heat Transfer, Vol. 131, 062901 (1-9), 2009.
  7. Krishna Kota, Louis Chow, Quinn Leland, “Heat Transfer Performance of a Dual Latent Heat Sink for Pulsed Heat Loads,” International Journal of Aerospace, Vol. 1, No. 1, pp. 1078-1087, 2009 (selected as one of the most outstanding technical papers of the year).
  8. Krishna Kota, Louis Chow, Jianhua Du, Jayanta Kapat, Quinn Leland, Richard Harris, “Numerical Simulation of Heat Storage Phenomenon in a Dual Latent Heat Sink,” Journal of Thermophysics and Heat Transfer, Vol. 23, No. 1, pp. 148-156, 2009.
  9. Krishna Kota, Louis Chow, Jianhua Du, Jayanta Kapat, Quinn Leland, Richard Harris, “Design of a Dual Latent Heat Sink for Pulsed Electronic Systems,” Journal of Thermophysics and Heat Transfer, Vol. 22, No. 4, pp. 572-580, 2008.